ISL59885ISZ-T13
vs
LM1881N-X/NOPB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTERSIL CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
DIP
Package Description
SOP, SOP8,.25
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
26 Weeks
Consumer IC Type
SYNC SEPARATOR IC
SYNC SEPARATOR IC
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
4.9022 mm
9.817 mm
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7272 mm
5.08 mm
Supply Current-Max
4 mA
12 mA
Supply Voltage-Max (Vsup)
5 V
12 V
Supply Voltage-Min (Vsup)
3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9116 mm
7.62 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Compare ISL59885ISZ-T13 with alternatives
Compare LM1881N-X/NOPB with alternatives