ISL5761/2IB
vs
HI5760IA
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
PLASTIC, MS-013AE, SOIC-28
|
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Analog Output Voltage-Max |
1.25 V
|
1.25 V
|
| Analog Output Voltage-Min |
-1 V
|
-0.3 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
|
| Length |
17.9 mm
|
9.7 mm
|
| Linearity Error-Max (EL) |
0.0488%
|
0.09765625%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
COMMERCIAL
|
|
| Seated Height-Max |
2.65 mm
|
1.2 mm
|
| Settling Time-Nom (tstl) |
0.035 µs
|
0.035 µs
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.5 mm
|
4.4 mm
|
| Base Number Matches |
2
|
4
|
| Rohs Code |
|
Yes
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
TSSOP28,.25
|
| Supply Current-Max |
|
30 mA
|
|
|
|