ISL5571AIB
vs
LE75181CQC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
LEGERITY INC
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
SOIC-16
|
HVQCCN,
|
| Pin Count |
16
|
28
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G16
|
S-XQCC-N28
|
| JESD-609 Code |
e0
|
|
| Length |
10.3 mm
|
6 mm
|
| Moisture Sensitivity Level |
4
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
HVQCCN
|
| Package Equivalence Code |
SOP16,.4
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
1 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIMOS
|
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.5 mm
|
6 mm
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare ISL5571AIB with alternatives
Compare LE75181CQC with alternatives