ISL55210IRTZ-T7A
vs
ISL55210IRTZ
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
TQFN
|
TQFN
|
| Package Description |
HVQCCN, LCC16,.12SQ,20
|
HVQCCN, LCC16,.12SQ,20
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
78 Weeks
|
26 Weeks, 1 Day
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
140 µA
|
140 µA
|
| Common-mode Reject Ratio-Nom |
75 dB
|
75 dB
|
| Input Offset Voltage-Max |
1600 µV
|
1600 µV
|
| JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
LCC16,.12SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Slew Rate-Nom |
150 V/us
|
150 V/us
|
| Supply Current-Max |
39.5 mA
|
39.5 mA
|
| Supply Voltage Limit-Max |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Unity Gain BW-Nom |
4000000
|
4000000
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
4
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
L16.3X3D
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bandwidth (3dB)-Nom |
|
30 MHz
|
| Bias Current-Max (IIB) @25C |
|
120 µA
|
| Common-mode Reject Ratio-Min |
|
56 dB
|
| Frequency Compensation |
|
NO
|
| Input Offset Current-Max (IIO) |
|
5 µA
|
| Low-Bias |
|
NO
|
| Low-Offset |
|
NO
|
| Micropower |
|
NO
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Voltage Gain-Min |
|
19952.62315
|
| Wideband |
|
YES
|
|
|
|
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