ISL54224IRTZ-T
vs
FSA660TMX
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
INTERSIL CORP
|
ONSEMI
|
Part Package Code |
DFN, uTQFN
|
|
Package Description |
SON, SOLCC10,.12,20
|
TMLP-18
|
Pin Count |
10, 10
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
26 Weeks
|
2 Days
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
S-PDSO-N10
|
R-XQCC-N18
|
JESD-609 Code |
e3
|
|
Length |
3 mm
|
2.8 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
1
|
Number of Terminals |
10
|
18
|
On-state Resistance-Max (Ron) |
25 Ω
|
8 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SON
|
HVQCCN
|
Package Equivalence Code |
SOLCC10,.12,20
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.8 mm
|
0.4 mm
|
Surface Mount |
YES
|
YES
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
NICKEL SILVER GOLD PALLADIUM
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
2 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Manufacturer Package Code |
|
722AB
|
Date Of Intro |
|
2017-10-09
|
Samacsys Manufacturer |
|
onsemi
|
Number of Channels |
|
1
|
Off-state Isolation-Nom |
|
28 dB
|
On-state Resistance Match-Nom |
|
0.1 Ω
|
Supply Voltage-Max (Vsup) |
|
5 V
|
Supply Voltage-Min (Vsup) |
|
1.5 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Switch-off Time-Max |
|
300 ns
|
Switch-on Time-Max |
|
600 ns
|
|
|
|
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