ISL51002CQZ-110
vs
ISL51002CQZ-165
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
QFP
|
MQFP
|
| Package Description |
14 X 20 MM, ROHS COMPLIANT, PLASTIC, MS-022, MQFP-128
|
FQFP, QFP128,.67X.93,20
|
| Pin Count |
128
|
128
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
26 Weeks
|
| Additional Feature |
IT CAN ALSO OPERATES WITH 3.3V
|
IT CAN ALSO OPERATES WITH 3.3V
|
| Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
| JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
| JESD-609 Code |
e3
|
e3
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
2A
|
2A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
128
|
128
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Equivalence Code |
QFP128,.67X.93,20
|
QFP128,.67X.93,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
3.4 mm
|
| Supply Voltage-Max (Vsup) |
1.98 V
|
1.98 V
|
| Supply Voltage-Min (Vsup) |
1.62 V
|
1.62 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
|
|
|