ISL28217FBBZ
vs
ISL28207FBZ-T7
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTERSIL CORP
|
| Package Description |
,
|
SOP, SOP8,.25
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Date Of Intro |
2020-10-29
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.0015 µA
|
0.0006 µA
|
| Bias Current-Max (IIB) @25C |
0.001 µA
|
|
| Common-mode Reject Ratio-Min |
120 dB
|
|
| Common-mode Reject Ratio-Nom |
145 dB
|
145 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
110 µV
|
140 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Length |
4.9 mm
|
4.9 mm
|
| Low-Bias |
NO
|
YES
|
| Low-Offset |
YES
|
YES
|
| Micropower |
YES
|
YES
|
| Neg Supply Voltage Limit-Max |
-21 V
|
-42 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Slew Rate-Nom |
0.5 V/us
|
0.32 V/us
|
| Supply Current-Max |
1.36 mA
|
0.7 mA
|
| Supply Voltage Limit-Max |
21 V
|
42 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1500
|
1000
|
| Voltage Gain-Min |
3162277.66
|
3000000
|
| Wideband |
NO
|
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
DFN, MSOP, SOIC
|
| Pin Count |
|
8, 8, 8
|
| Factory Lead Time |
|
26 Weeks
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
2
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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