ISL28177FBZ
vs
ISL28177FBZ-T
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
SOP,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
26 Weeks
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.001 µA
|
0.001 µA
|
| Common-mode Reject Ratio-Nom |
140 dB
|
140 dB
|
| Input Offset Voltage-Max |
350 µV
|
350 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Slew Rate-Nom |
0.2 V/us
|
0.2 V/us
|
| Supply Voltage Limit-Max |
44 V
|
44 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Unity Gain BW-Nom |
600
|
600
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
5
|
4
|
| Rohs Code |
|
Yes
|
|
|
|
Compare ISL28177FBZ with alternatives
Compare ISL28177FBZ-T with alternatives