ISDMICROTAD-16MP vs ISD33150ED feature comparison

ISDMICROTAD-16MP Nuvoton Technology Corp

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ISD33150ED Winbond Electronics Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INFORMATION STORAGE DEVICES WINBOND ELECTRONICS CORP
Part Package Code DIP TSOP
Package Description , 8 X 13.40 MM, PLASTIC, TSOP1-28
Pin Count 28 28
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Application ANSWERING MACHINE
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-PDSO-G28
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 50 °C 70 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 960 s 157.1 s
Supply Voltage-Max (Vsup) 3.15 V 3.3 V
Supply Voltage-Min (Vsup) 2.85 V 2.7 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Length 11.8 mm
On Chip Memory Type EEPROM
Package Equivalence Code TSSOP28,.53,22
Seated Height-Max 1.2 mm
Supply Current-Max 40 mA
Terminal Finish TIN LEAD
Terminal Pitch 0.55 mm
Width 8 mm

Compare ISDMICROTAD-16MP with alternatives

Compare ISD33150ED with alternatives