ISD5008X
vs
ISD1610BSYI
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
DIE
|
SOIC
|
| Package Description |
DIE,
|
SOP,
|
| Pin Count |
25
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Application |
CELLULAR PHONE; PORTABLE APPLIANCES
|
|
| Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
| JESD-30 Code |
R-XUUC-N25
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
25
|
16
|
| On Chip Memory Type |
FLASH
|
FLASH
|
| Operating Temperature-Max |
50 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reading Time-Max |
480 s
|
20 s
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.4 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Length |
|
9.9 mm
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.75 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
3.9 mm
|
|
|
|
Compare ISD5008X with alternatives
Compare ISD1610BSYI with alternatives