ISD5008X
vs
I1750PY
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INFORMATION STORAGE DEVICES
|
WINBOND ELECTRONICS CORP
|
Part Package Code |
DIE
|
DIP
|
Package Description |
DIE,
|
DIP,
|
Pin Count |
25
|
28
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
R-XUUC-N25
|
R-PDIP-T28
|
Number of Terminals |
25
|
28
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
2
|
1
|
JESD-609 Code |
|
e3
|
Length |
|
36.83 mm
|
Number of Functions |
|
1
|
On Chip Memory Type |
|
FLASH
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Package Equivalence Code |
|
DIP28,.6
|
Reading Time-Max |
|
100 s
|
Seated Height-Max |
|
4.83 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
2.4 V
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
MATTE TIN
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
15.24 mm
|
|
|
|
Compare ISD5008X with alternatives
Compare I1750PY with alternatives