ISD4003-06MXYI vs I1740SY01 feature comparison

ISD4003-06MXYI Nuvoton Technology Corp

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I1740SY01 Winbond Electronics Corp

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Part Package Code DIE SOIC
Package Description DIE, SOP,
Pin Count 19 28
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-XUUC-N19 R-PDSO-G28
Number of Functions 1 1
Number of Terminals 19 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Equivalence Code DIE OR CHIP SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 360 s 80 s
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.4 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 1 1
JESD-609 Code e3
Length 17.93 mm
Seated Height-Max 2.64 mm
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Width 7.52 mm

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