ISD4003-06MXI
vs
ISD1416P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
WINBOND ELECTRONICS CORP
INFORMATION STORAGE DEVICES
Part Package Code
DIE
DIP
Package Description
DIE,
DIP, DIP28,.6
Pin Count
19
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-XUUC-N19
R-PDIP-T28
Number of Functions
1
1
Number of Terminals
19
28
On Chip Memory Type
FLASH
EEPROM
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
360 s
16 s
Supply Voltage-Max (Vsup)
3.3 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
2
2
Rohs Code
JESD-609 Code
e0
Supply Current-Max
30 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare ISD4003-06MXI with alternatives
Compare ISD1416P with alternatives