ISD4003-06MXI vs I17210PYI01 feature comparison

ISD4003-06MXI Nuvoton Technology Corp

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I17210PYI01 Winbond Electronics Corp

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Part Package Code DIE DIP
Package Description DIE, DIP,
Pin Count 19 28
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-XUUC-N19 R-PDIP-T28
Number of Functions 1 1
Number of Terminals 19 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 360 s 420 s
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.4 V
Surface Mount YES NO
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 1 1
JESD-609 Code e3
Length 36.83 mm
Seated Height-Max 4.83 mm
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Width 15.24 mm

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