ISD4003-06MSYD
vs
ISD33150P
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SOP,
|
0.600 INCH, PLASTIC, DIP-28
|
Pin Count |
28
|
28
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
R-PDSO-G28
|
R-PDIP-T28
|
Length |
17.93 mm
|
36.83 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
On Chip Memory Type |
FLASH
|
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reading Time-Max |
360 s
|
155.6 s
|
Seated Height-Max |
2.65 mm
|
4.83 mm
|
Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.52 mm
|
15.24 mm
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
DIP28,.6
|
Supply Current-Max |
|
40 mA
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare ISD4003-06MSYD with alternatives
Compare ISD33150P with alternatives