ISD4003-06MSY vs I17180XY01 feature comparison

ISD4003-06MSY Winbond Electronics Corp

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I17180XY01 Winbond Electronics Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC DIE
Package Description SOP, SOP28,.4 DIE,
Pin Count 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 X-XUUC-N
Length 17.93 mm
Number of Functions 1 1
Number of Terminals 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 70 °C 50 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Equivalence Code SOP28,.4
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 360 s 360 s
Seated Height-Max 2.64 mm
Supply Current-Max 40 mA
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.4 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Width 7.52 mm
Base Number Matches 2 1

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Compare I17180XY01 with alternatives