ISD4003-06MPI vs ISDMICROTAD-16ME feature comparison

ISD4003-06MPI Nuvoton Technology Corp

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ISDMICROTAD-16ME Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Part Package Code DIP TSOP
Package Description DIP, 8 X 13.40 MM, PLASTIC, TSOP1-28
Pin Count 28 28
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-PDSO-G28
Length 36.83 mm 11.8 mm
Number of Functions 1 1
Number of Terminals 28 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 50 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSOP1
Package Equivalence Code DIP28,.6 TSSOP28,.53,22
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 360 s 960 s
Seated Height-Max 4.83 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.3 V 3.15 V
Supply Voltage-Min (Vsup) 2.7 V 2.85 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.55 mm
Terminal Position DUAL DUAL
Width 15.24 mm 8 mm
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Supply Current-Max 40 mA
Terminal Finish TIN LEAD

Compare ISD4003-06MPI with alternatives

Compare ISDMICROTAD-16ME with alternatives