ISD33150ED vs ISD33150EI feature comparison

ISD33150ED Nuvoton Technology Corp

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ISD33150EI Winbond Electronics Corp

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INFORMATION STORAGE DEVICES WINBOND ELECTRONICS CORP
Package Description TSSOP, TSSOP28,.53,22 8 X 13.40 MM, PLASTIC, TSOP1-28
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e0 e0
Number of Functions 1 1
Number of Terminals 28 28
On Chip Memory Type EEPROM EEPROM
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Equivalence Code TSSOP28,.53,22 TSSOP28,.53,22
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 157.1 s 162 s
Supply Current-Max 40 mA 40 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.55 mm 0.55 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code TSOP
Pin Count 28
Length 11.8 mm
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Seated Height-Max 1.2 mm
Temperature Grade INDUSTRIAL
Width 8 mm

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