ISD33075PI
vs
I17210XYIR01
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
DIP
DIE
Package Description
0.600 INCH, PLASTIC, DIP-28
DIE,
Pin Count
28
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDIP-T28
X-XUUC-N
JESD-609 Code
e0
Length
36.83 mm
Number of Functions
1
1
Number of Terminals
28
On Chip Memory Type
EEPROM
FLASH
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIE
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
IN-LINE
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
81 s
420 s
Seated Height-Max
4.83 mm
Supply Current-Max
40 mA
Supply Voltage-Max (Vsup)
3.3 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
2.4 V
Surface Mount
NO
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Width
15.24 mm
Base Number Matches
1
1
Compare ISD33075PI with alternatives
Compare I17210XYIR01 with alternatives