ISD33075P
vs
ISD5008X
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INFORMATION STORAGE DEVICES
|
WINBOND ELECTRONICS CORP
|
| Package Description |
DIP, DIP28,.6
|
DIE,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
| JESD-30 Code |
R-PDIP-T28
|
R-XUUC-N25
|
| JESD-609 Code |
e0
|
e0
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
25
|
| On Chip Memory Type |
EEPROM
|
FLASH
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP28,.6
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reading Time-Max |
78.3 s
|
480 s
|
| Supply Current-Max |
40 mA
|
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DIE
|
| Pin Count |
|
25
|
| Application |
|
CELLULAR PHONE; PORTABLE APPLIANCES
|
| Operating Temperature-Max |
|
50 °C
|
| Operating Temperature-Min |
|
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare ISD33075P with alternatives
Compare ISD5008X with alternatives