ISD33060PI
vs
ISD4002-120ZI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INFORMATION STORAGE DEVICES
|
WINBOND ELECTRONICS CORP
|
Package Description |
DIP, DIP28,.6
|
VFBGA, BGA19,4X5,30
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
R-PDIP-T28
|
R-PBGA-B19
|
JESD-609 Code |
e0
|
e0
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
19
|
On Chip Memory Type |
EEPROM
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
VFBGA
|
Package Equivalence Code |
DIP28,.6
|
BGA19,4X5,30
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reading Time-Max |
64.6 s
|
120 s
|
Supply Current-Max |
40 mA
|
40 mA
|
Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
BALL
|
Terminal Pitch |
2.54 mm
|
0.75 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
19
|
Length |
|
6.1 mm
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Seated Height-Max |
|
0.85 mm
|
Temperature Grade |
|
INDUSTRIAL
|
Width |
|
4.7 mm
|
|
|
|
Compare ISD33060PI with alternatives
Compare ISD4002-120ZI with alternatives