ISD33060PI
vs
ISD4002-120EY
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INFORMATION STORAGE DEVICES
WINBOND ELECTRONICS CORP
Package Description
DIP, DIP28,.6
TSOP1, TSSOP28,.53,22
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDIP-T28
R-PDSO-G28
JESD-609 Code
e0
Number of Functions
1
1
Number of Terminals
28
28
On Chip Memory Type
EEPROM
FLASH
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSOP1
Package Equivalence Code
DIP28,.6
TSSOP28,.53,22
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
64.6 s
120 s
Supply Current-Max
40 mA
40 mA
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.55 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Part Package Code
TSOP
Pin Count
28
Length
11.8 mm
Operating Temperature-Max
70 °C
Operating Temperature-Min
Seated Height-Max
1.2 mm
Temperature Grade
COMMERCIAL
Width
8 mm
Compare ISD33060PI with alternatives
Compare ISD4002-120EY with alternatives