ISD33060PD vs ISD33060PI feature comparison

ISD33060PD Winbond Electronics Corp

Buy Now Datasheet

ISD33060PI Nuvoton Technology Corp

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP INFORMATION STORAGE DEVICES
Part Package Code DIP
Package Description 0.600 INCH, PLASTIC, DIP-28 DIP, DIP28,.6
Pin Count 28
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 36.83 mm
Number of Functions 1
Number of Terminals 28 28
Operating Temperature-Max 70 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 62.9 s 64.6 s
Seated Height-Max 4.83 mm
Supply Current-Max 40 mA 40 mA
Supply Voltage-Max (Vsup) 3.3 V
Supply Voltage-Min (Vsup) 2.7 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1

Compare ISD33060PD with alternatives

Compare ISD33060PI with alternatives