ISD25540S
vs
ISD1616BSYI01
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
28
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDSO-G28
R-PDSO-G16
Length
17.9 mm
9.9 mm
Number of Terminals
28
16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
1.75 mm
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
3.9 mm
Base Number Matches
2
2
Rohs Code
Moisture Sensitivity Level
3
Number of Functions
1
On Chip Memory Type
FLASH
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Peak Reflow Temperature (Cel)
260
Reading Time-Max
30 s
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
2.4 V
Temperature Grade
INDUSTRIAL
Time@Peak Reflow Temperature-Max (s)
40
Compare ISD25540S with alternatives
Compare ISD1616BSYI01 with alternatives