ISD1616BSYI01
vs
ISD33060PI
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP,
|
0.600 INCH, PLASTIC, DIP-28
|
| Pin Count |
16
|
28
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T28
|
| Length |
9.9 mm
|
36.83 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
28
|
| On Chip Memory Type |
FLASH
|
EEPROM
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reading Time-Max |
30 s
|
64.8 s
|
| Seated Height-Max |
1.75 mm
|
4.83 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.7 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 mm
|
15.24 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP28,.6
|
| Supply Current-Max |
|
40 mA
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare ISD1616BSYI01 with alternatives
Compare ISD33060PI with alternatives