ISD1612BXY01
vs
ISD1612BXYI
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
Part Package Code |
DIE
|
DIE
|
Package Description |
DIE,
|
DIE,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
R-XUUC-N16
|
R-XUUC-N16
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
On Chip Memory Type |
FLASH
|
FLASH
|
Operating Temperature-Max |
50 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIE
|
DIE
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reading Time-Max |
24 s
|
24 s
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Base Number Matches |
1
|
2
|
|
|
|
Compare ISD1612BXY01 with alternatives
Compare ISD1612BXYI with alternatives