ISD1612BPYI01
vs
ISD1612BP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Length
19.05 mm
19.05 mm
Number of Functions
1
1
Number of Terminals
16
16
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
24 s
24 s
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Surface Mount
NO
NO
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
Application
GREETING CARDS; TOYS; ANNUNCIATORS
Supply Current-Max
20 mA
Compare ISD1612BPYI01 with alternatives
Compare ISD1612BP with alternatives