ISD1612BPYI vs ISD1612BPI feature comparison

ISD1612BPYI Winbond Electronics Corp

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ISD1612BPI Nuvoton Technology Corp

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP NUVOTON TECHNOLOGY CORP
Part Package Code DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Length 19.05 mm
Number of Functions 1 1
Number of Terminals 16 16
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Reading Time-Max 24 s 24 s
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Surface Mount NO NO
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 2 2
Supply Current-Max 20 mA

Compare ISD1612BPYI with alternatives

Compare ISD1612BPI with alternatives