IS80LV32-24W
vs
SST89V58RD2-33-C-PIE
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
SILICON STORAGE TECHNOLOGY INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
0.600 INCH, PLASTIC, DIP-40
|
DIP,
|
Pin Count |
40
|
40
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
CPU Family |
8051
|
|
Clock Frequency-Max |
24 MHz
|
33 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
JESD-609 Code |
e0
|
e3
|
Length |
52.07 mm
|
51.943 mm
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
PWM Channels |
NO
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP40,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
256
|
|
Seated Height-Max |
5.08 mm
|
5.588 mm
|
Speed |
24 MHz
|
33 MHz
|
Supply Current-Max |
38 mA
|
|
Supply Voltage-Max |
3.63 V
|
3.6 V
|
Supply Voltage-Min |
2.97 V
|
2.7 V
|
Supply Voltage-Nom |
3.3 V
|
3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
3A991.A.2
|
Peak Reflow Temperature (Cel) |
|
260
|
ROM Programmability |
|
FLASH
|
|
|
|
Compare IS80LV32-24W with alternatives
Compare SST89V58RD2-33-C-PIE with alternatives