IS71VPCF16NS04-8585FI vs AM54BDS128AGT89IT feature comparison

IS71VPCF16NS04-8585FI Integrated Silicon Solution Inc

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AM54BDS128AGT89IT Spansion

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC SPANSION INC
Part Package Code BGA BGA
Package Description 8 X 11 MM, 0.80 MM PITCH, MINI, BGA-69 LFBGA,
Pin Count 69 93
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns
Additional Feature SRAM CONFIGURATION IS 256K X 16/512K X 8; FLASH IS ALSO CONFIGURABLE AS 2M X 8 SRAM IS ORGANISED AS 1M X 16
JESD-30 Code R-PBGA-B69 S-PBGA-B93
JESD-609 Code e0 e0
Length 11 mm 10 mm
Memory Density 16777216 bit 134217728 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM
Number of Functions 1 1
Number of Terminals 69 93
Number of Words 1048576 words 8388608 words
Number of Words Code 1000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 1MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA69,10X10,32
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.000005 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 3.3 V 1.95 V
Supply Voltage-Min (Vsup) 2.7 V 1.65 V
Supply Voltage-Nom (Vsup) 3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 10 mm
Base Number Matches 1 1

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Compare AM54BDS128AGT89IT with alternatives