IS66WVH16M8ALL-133B1LI
vs
IS66WVH16M8ALL-166BLE
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
INTEGRATED SILICON SOLUTION INC
|
Package Description |
TBGA, BGA24,5X5,40
|
TBGA, BGA25,5X5,40
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
36 ns
|
36 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PBGA-B24
|
R-PBGA-B25
|
Length |
8 mm
|
8 mm
|
Memory Density |
134217728 bit
|
134217728 bit
|
Memory IC Type |
PSEUDO STATIC RAM
|
PSEUDO STATIC RAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
25
|
Number of Words |
16777216 words
|
16777216 words
|
Number of Words Code |
16000000
|
16000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
16MX8
|
16MX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TBGA
|
TBGA
|
Package Equivalence Code |
BGA24,5X5,40
|
BGA25,5X5,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Standby Current-Max |
0.00002 A
|
0.00002 A
|
Supply Current-Max |
0.06 mA
|
0.06 mA
|
Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
6 mm
|
6 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IS66WVH16M8ALL-133B1LI with alternatives
Compare IS66WVH16M8ALL-166BLE with alternatives