IS66WV51216ALL-70BLI
vs
HY62UF16803ASLM-70I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SEIKO INSTRUMENTS USA INC
SK HYNIX INC
Part Package Code
DSBGA
BGA
Package Description
8 X 6 MM, LEAD FREE, MO-207, TFBGA-48
VFBGA,
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8 mm
8.5 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
PSEUDO STATIC RAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
0.95 mm
Supply Voltage-Max (Vsup)
1.95 V
3.3 V
Supply Voltage-Min (Vsup)
1.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
7.4 mm
Base Number Matches
2
1
JESD-609 Code
e1
Supply Voltage-Nom (Vsup)
3 V
Terminal Finish
TIN SILVER COPPER
Compare IS66WV51216ALL-70BLI with alternatives
Compare HY62UF16803ASLM-70I with alternatives