IS64WV2568FBLL-10KLA3
vs
IS64WV2568FBLL-10BA3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
SOJ,
TFBGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Date Of Intro
2018-02-21
2018-02-21
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-J36
R-PBGA-B36
Length
23.49 mm
8 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
36
36
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX8
256KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOJ
TFBGA
Package Equivalence Code
SOJ36,.44
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
3.76 mm
1.2 mm
Standby Current-Max
0.02 A
Standby Voltage-Min
2 V
Supply Current-Max
0.04 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
J BEND
BALL
Terminal Pitch
1.27 mm
0.75 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
6 mm
Base Number Matches
1
1
Compare IS64WV2568FBLL-10KLA3 with alternatives
Compare IS64WV2568FBLL-10BA3 with alternatives