IS64WV2568FBLL-10KLA3
vs
IS64WV2568FBLL-10BA3
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
INTEGRATED SILICON SOLUTION INC
|
| Package Description |
SOJ,
|
TFBGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Date Of Intro |
2018-02-21
|
2018-02-21
|
| Access Time-Max |
10 ns
|
10 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDSO-J36
|
R-PBGA-B36
|
| Length |
23.49 mm
|
8 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
36
|
36
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256KX8
|
256KX8
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOJ
|
TFBGA
|
| Package Equivalence Code |
SOJ36,.44
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
3.76 mm
|
1.2 mm
|
| Standby Current-Max |
0.02 A
|
|
| Standby Voltage-Min |
2 V
|
|
| Supply Current-Max |
0.04 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
J BEND
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.75 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
10.16 mm
|
6 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare IS64WV2568FBLL-10KLA3 with alternatives
Compare IS64WV2568FBLL-10BA3 with alternatives