IS64WV25616MEBLL-10CTA1
vs
IS61WV25616EFBLL-10B2I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
TSOP2,
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Date Of Intro
2017-03-08
Access Time-Max
10 ns
10 ns
JESD-30 Code
R-PDSO-G44
R-PBGA-B48
Length
18.41 mm
8 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX16
256KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.8 mm
0.75 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
6 mm
Base Number Matches
1
1
Rohs Code
I/O Type
COMMON
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
YES
Package Equivalence Code
BGA48,6X8,30
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Standby Current-Max
0.015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.035 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare IS64WV25616MEBLL-10CTA1 with alternatives
Compare IS61WV25616EFBLL-10B2I with alternatives