IS64WV25616LEBLL-12BLA3 vs IS64WV25616LEBLL-12CTLA3 feature comparison

IS64WV25616LEBLL-12BLA3 Integrated Silicon Solution Inc

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IS64WV25616LEBLL-12CTLA3 Integrated Silicon Solution Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TFBGA, TSOP2,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 2017-03-08 2017-03-08
Access Time-Max 12 ns 12 ns
JESD-30 Code R-PBGA-B48 R-PDSO-G44
JESD-609 Code e1
Length 8 mm 18.41 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP2
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 10 10
Width 6 mm 10.16 mm
Base Number Matches 1 1

Compare IS64WV25616LEBLL-12BLA3 with alternatives

Compare IS64WV25616LEBLL-12CTLA3 with alternatives