IS64WV102416DBLL-12BLA3
vs
IS64WV102416EDBLL-12CTA3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
TFBGA,
12 X 20 MM, TSOP1-48
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
12 ns
JESD-30 Code
R-PBGA-B48
R-PDSO-G48
Length
8 mm
18.4 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TSOP1
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
BALL
GULL WING
Terminal Pitch
0.75 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
6 mm
12 mm
Base Number Matches
1
1
Compare IS64WV102416DBLL-12BLA3 with alternatives
Compare IS64WV102416EDBLL-12CTA3 with alternatives