IS64LPS12836EC-200TQLA3-TR vs 71V35761SA200BGI feature comparison

IS64LPS12836EC-200TQLA3-TR Integrated Silicon Solution Inc

Buy Now Datasheet

71V35761SA200BGI Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description LQFP, BGA-119
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 12 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc.
Access Time-Max 3.1 ns 3.1 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED
JESD-30 Code R-PQFP-G100 R-PBGA-B119
Length 20 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX36 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 14 mm
Base Number Matches 1 2
Pbfree Code No
Part Package Code PBGA
Pin Count 119
Manufacturer Package Code BG119
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

Compare IS64LPS12836EC-200TQLA3-TR with alternatives

Compare 71V35761SA200BGI with alternatives