IS64LF204836B-7.5B3LA3
vs
IS61LF204836B-7.5TQL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
TBGA,
LQFP, QFP100,.63X.87
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
7.5 ns
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
Length
15 mm
20 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
1.2 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.165 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
13 mm
14 mm
Base Number Matches
1
1
Rohs Code
Part Package Code
QFP
Pin Count
100
Clock Frequency-Max (fCLK)
117 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63X.87
Qualification Status
Not Qualified
Standby Voltage-Min
3.14 V
Compare IS64LF204836B-7.5B3LA3 with alternatives
Compare IS61LF204836B-7.5TQL with alternatives