IS62WV5128DALL-55HLI
vs
IS62WV5128EALL-55BLI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
TSOP1
Package Description
TSOP1, TSSOP32,.56,20
TFBGA,
Pin Count
32
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G32
R-PBGA-B36
Length
11.8 mm
8 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
36
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX8
512KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TFBGA
Package Equivalence Code
TSSOP32,.56,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.000007 A
Standby Voltage-Min
1.2 V
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
2.2 V
2.2 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.75 mm
Terminal Position
DUAL
BOTTOM
Width
8 mm
6 mm
Base Number Matches
1
2
Compare IS62WV5128DALL-55HLI with alternatives
Compare IS62WV5128EALL-55BLI with alternatives