IS62WV2568EBLL-45BLI-TR vs IS62WV2568EBLL-45TLI feature comparison

IS62WV2568EBLL-45BLI-TR Integrated Silicon Solution Inc

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IS62WV2568EBLL-45TLI Integrated Silicon Solution Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TFBGA, TSOP1,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 10 Weeks 10 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc. Integrated Silicon Solution Inc.
Access Time-Max 45 ns 45 ns
JESD-30 Code R-PBGA-B36 R-PDSO-G32
Length 8 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 36 32
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.2 V 2.2 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 10
Width 6 mm
Base Number Matches 1 1
JESD-609 Code e3
Moisture Sensitivity Level 3
Terminal Finish Matte Tin (Sn)

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Compare IS62WV2568EBLL-45TLI with alternatives