IS62UP6416SL-100BI vs KM616FS1010AFI-7 feature comparison

IS62UP6416SL-100BI Integrated Silicon Solution Inc

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KM616FS1010AFI-7 Samsung Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description MINI, BGA-48 TFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 70 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.3 V 2.7 V
Supply Voltage-Min (Vsup) 2.7 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
I/O Type COMMON
Length 7 mm
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Seated Height-Max 1.2 mm
Standby Voltage-Min 1 V
Supply Current-Max 0.03 mA
Terminal Pitch 0.75 mm
Width 6 mm

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