IS62C256-100W vs MSM832TLM-10 feature comparison

IS62C256-100W Integrated Silicon Solution Inc

Buy Now Datasheet

MSM832TLM-10 Mosaic Semiconductor Inc

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC MOSAIC SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description 0.600 INCH, PLASTIC, DIP-28 ,
Pin Count 28 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 100 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T28 R-CDIP-T28
JESD-609 Code e0
Length 36.576 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.699 mm
Standby Current-Max 0.0002 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.065 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 2

Compare IS62C256-100W with alternatives

Compare MSM832TLM-10 with alternatives