IS61WV51216EEBLL-10T3LI vs IS61WV51216EEBLL-10BLI feature comparison

IS61WV51216EEBLL-10T3LI Integrated Silicon Solution Inc

Buy Now Datasheet

IS61WV51216EEBLL-10BLI Integrated Silicon Solution Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TSOP2, TFBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 2017-01-19 2017-01-19
Access Time-Max 10 ns 10 ns
JESD-30 Code R-PDSO-G54 R-PBGA-B48
Length 22.22 mm 8 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 54 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 10.16 mm 6 mm
Base Number Matches 1 1
Factory Lead Time 10 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc.
JESD-609 Code e1
Package Equivalence Code BGA48,6X8,30
Terminal Finish TIN SILVER COPPER

Compare IS61WV51216EEBLL-10T3LI with alternatives

Compare IS61WV51216EEBLL-10BLI with alternatives