IS61WV2568FBLL-10BI
vs
AS7C32096A-10TINTR
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
ALLIANCE MEMORY INC
|
| Package Description |
TFBGA,
|
TSOP2,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Date Of Intro |
2018-02-21
|
|
| Access Time-Max |
10 ns
|
10 ns
|
| JESD-30 Code |
R-PBGA-B36
|
R-PDSO-G44
|
| Length |
8 mm
|
18.415 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
44
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256KX8
|
256KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TSOP2
|
| Package Equivalence Code |
BGA36,6X8,30
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.75 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
6 mm
|
10.16 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TSOP2
|
| Pin Count |
|
44
|
| Samacsys Manufacturer |
|
Alliance Memory
|
| JESD-609 Code |
|
e3/e6
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare IS61WV2568FBLL-10BI with alternatives
Compare AS7C32096A-10TINTR with alternatives