IS61WV20488FBLL-10TLI vs AS7C316096C-10BIN feature comparison

IS61WV20488FBLL-10TLI Integrated Silicon Solution Inc

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AS7C316096C-10BIN Alliance Memory Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC ALLIANCE MEMORY INC
Package Description TSOP2, LFBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 10 Weeks 20 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc. Alliance Memory
Access Time-Max 10 ns 10 ns
JESD-30 Code R-PDSO-G44 R-PBGA-B48
JESD-609 Code e3
Length 18.41 mm 8 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 44 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 10
Width 10.16 mm 6 mm
Base Number Matches 1 1

Compare IS61WV20488FBLL-10TLI with alternatives

Compare AS7C316096C-10BIN with alternatives