IS61WV20488ALL-20MI
vs
BS62LV1600FIP55
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
BRILLIANCE SEMICONDUCTOR INC
Part Package Code
DSBGA
BGA
Package Description
TFBGA, BGA48,6X8,30
LFBGA, BGA48,6X8,30
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
Length
11 mm
12 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX8
2MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA48,6X8,30
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Standby Current-Max
0.025 A
Standby Voltage-Min
1.2 V
1.5 V
Supply Current-Max
0.1 mA
0.115 mA
Supply Voltage-Max (Vsup)
2.2 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
3 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
9 mm
9 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
260
Compare IS61WV20488ALL-20MI with alternatives
Compare BS62LV1600FIP55 with alternatives