IS61WV10248EEBLL-10T3LI vs IS61WV102416DBLL-10BLI-TR feature comparison

IS61WV10248EEBLL-10T3LI Integrated Silicon Solution Inc

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IS61WV102416DBLL-10BLI-TR Integrated Silicon Solution Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TSOP2, TFBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 10 ns
JESD-30 Code R-PDSO-G54 R-PBGA-B48
JESD-609 Code e3 e1
Length 22.22 mm 8 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 54 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form GULL WING BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 10 NOT SPECIFIED
Width 10.16 mm 6 mm
Base Number Matches 1 1
Factory Lead Time 10 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc.
Package Equivalence Code BGA48,6X8,30

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Compare IS61WV102416DBLL-10BLI-TR with alternatives