IS61VPS51236B-250B2
vs
IS61VPS51236B-250B2L
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
BGA,
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
2.6 ns
2.6 ns
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX36
512KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
4
2
Category CO2 Kg
12
Compliance Temperature Grade
Commercial: +0C to +70C
EU RoHS Version
RoHS 2 (2015/863/EU)
Candidate List Date
2023-06-14
EFUP
e
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.01
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare IS61VPS51236B-250B2 with alternatives
Compare IS61VPS51236B-250B2L with alternatives