IS61VPS204836B-250B3L-TR vs IS61VPS204836B-250B2LI feature comparison

IS61VPS204836B-250B3L-TR Integrated Silicon Solution Inc

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IS61VPS204836B-250B2LI Integrated Silicon Solution Inc

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TBGA, BGA, BGA119,7X17,50
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 12 Weeks
Access Time-Max 2.8 ns 2.6 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B119
Length 15 mm 22 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36 2MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.2 mm 3.5 mm
Supply Voltage-Max (Vsup) 2.625 V 2.625 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 10
Width 13 mm 14 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 119
Clock Frequency-Max (fCLK) 250 MHz
I/O Type COMMON
JESD-609 Code e1
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Qualification Status Not Qualified
Standby Voltage-Min 2.38 V
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

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