IS61VF12836A-7.5B3I
vs
IS61VPS10018-166TQ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SEIKO INSTRUMENTS USA INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
QFP
Package Description
TBGA,
TQFP-100
Pin Count
165
100
Reach Compliance Code
unknown
compliant
Access Time-Max
7.5 ns
3.5 ns
Additional Feature
PIPELINED/FLOW-THROUGH ARCHITECTURE, ALSO OPERATES WITH 3.135V TO 3.465V SUPPLY
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
Length
15 mm
20 mm
Memory Density
4718592 bit
18874368 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
36
18
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
131072 words
1048576 words
Number of Words Code
128000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX36
1MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
13 mm
14 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare IS61VF12836A-7.5B3I with alternatives
Compare IS61VPS10018-166TQ with alternatives